購買 NE68719-T1與BYCHPS
購買即有保證
NE68719-T1
- 型號:
- NE68719-T1
- 描述:
- TRANS NPN 2GHZ SMD
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 17996 Pieces
- 數據表:
- NE68719-T1.pdf
簡單介紹
BYCHIPS是 NE68719-T1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NE68719-T1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 3V |
|---|---|
| 晶體管類型: | NPN |
| 供應商設備封裝: | 3-SuperMiniMold (19) |
| 系列: | - |
| 功率 - 最大: | 90mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | SOT-523 |
| 其他名稱: | 2SC5186 NE68719-T1TR NE68719-TR NE68719TR |
| 工作溫度: | 150°C (TJ) |
| 噪聲係數（dB典型值@頻率）: | 1.3dB ~ 2dB @ 2GHz |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | NE68719-T1 |
| 獲得: | - |
| 頻率 - 轉換: | 11GHz |
| 展開說明: | RF Transistor NPN 3V 30mA 11GHz 90mW Surface Mount 3-SuperMiniMold (19) |
| 描述: | TRANS NPN 2GHZ SMD |
| 直流電流增益（HFE）（最小值）@ IC，的Vce: | 70 @ 20mA, 2V |
| 電流 - 集電極（Ic）（最大）: | 30mA |
| Email: | [email protected] |
NE68719-T1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MSC2295-CT1 | ON Semiconductor | TRANS NPN RF BIPO 20V SC-59 | 在線詢價 |
 |
2SC5088-O(TE85L,F) | Toshiba Semiconductor and Storage | TRANS RF NPN 12V 500MHZ USQ | 在線詢價 |
 |
NE687M03-T1-A | CEL | TRANSISTOR NPN 2GHZ MINIMOLD | 在線詢價 |
 |
2SC5751-T2-A | CEL | RF TRANSISTOR NPN SOT-343F | 在線詢價 |
|
NE687M33-T3-A | CEL | TRANSISTOR NPN 2GHZ M33 | 在線詢價 |
 |
MS2213 | Microsemi Corporation | TRANS RF BIPO 75W 3.5A M214 | 在線詢價 |
 |
NE68730-T1 | CEL | TRANS NPN 2GHZ SOT-323 | 在線詢價 |
 |
BFR520,235 | NXP USA Inc. | TRANS NPN 15V 70MA 9GHZ SOT23 | 在線詢價 |
|
NE687M33-A | CEL | TRANSISTOR NPN 2GHZ M33 | 在線詢價 |
|
MRF4427R1 | Microsemi Corporation | TRANS NPN 20V 400MA SO8 | 在線詢價 |
|
NE687M13-A | CEL | TRANSISTOR NPN 2GHZ M13 | 在線詢價 |
 |
BFS 380L6 E6327 | Infineon Technologies | TRANSISTOR GP BJT NPN 6V TSLP-6 | 在線詢價 |
|
NE687M03-A | CEL | TRANSISTOR NPN 2GHZ MINIMOLD | 在線詢價 |
|
NE85633-R24-A | CEL | RF TRANSISTOR NPN SOT-23 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog